AMD Ryzen 9 9950X3D processor 4.3 GHz 144 MB L2 & L3 Tray
Description
| Processor | |
|---|---|
| Processor generation | AMD Ryzen 9000 Series |
| Processor base frequency | 4.3 GHz |
| Processor manufacturer | AMD |
| Cooler included | No |
| Thermal Design Power (TDP) | 170 W |
| Processor cache | 144 MB |
| Processor model | 9950X3D |
| Processor threads | 32 |
| Processor operating modes | 64-bit |
| Processor boost frequency | 5.7 GHz |
| Processor lithography | 4 nm |
| Processor family | AMD Ryzen™ 9 |
| Processor cores | 16 |
| Processor socket | Socket AM5 |
| Processor cache type | L2 & L3 |
| Package type | Tray |
| Memory | |
| Maximum internal memory supported by processor | 192 GB |
| Memory types supported by processor | DDR5-SDRAM |
| Memory clock speeds supported by processor | 3600,5600 MHz |
| Memory channels | Dual-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | AMD Radeon Graphics |
| On-board graphics card | Yes |
| On-board graphics card base frequency | 2200 MHz |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 170 W |
| Technical details | |
| PCI Express slots version | 5.0 |
| Supported instruction sets | AES, AVX, AVX 2.0, AVX-512, SSE, SSE2, SSE3, SSE4.1, SSE4.2, SSSE3 |
| Thermal Design Power (TDP) | 170 W |
| Market segment | Desktop |
| Processor cache type | L2 & L3 |
| Features | |
| Maximum number of PCI Express lanes | 28 |
| Thermal Design Power (TDP) | 170 W |
| PCI Express slots version | 5.0 |
| Supported instruction sets | AES, AVX, AVX 2.0, AVX-512, SSE, SSE2, SSE3, SSE4.1, SSE4.2, SSSE3 |
| Market segment | Desktop |
| I/O configuration | |
| USB version | 3.2 Gen 2 (3.1 Gen 2) |
| USB ports quantity | 4 |
| Operational conditions | |
| Minimum operating temperature | 95 °C |
| Packaging data | |
| Package type | Tray |
Specifications
UNSPSC Code
43201503
Brand
AMD
Categories
System Components
Category
Processors
